Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices / Edition 1

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ISBN-10:: 0791801683
ISBN-13:: 9780791801680
Pub. Date:: 01/29/2002
Publisher:: A S M E Press

ISBN-10:: 0791801683
ISBN-13:: 9780791801680
Pub. Date:: 01/29/2002
Publisher:: A S M E Press

Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices / Edition 1

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Overview

By Lian-Tuu Yeh and Richard C. Chu

With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels.

This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.

While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment.

The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume.

The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions.

They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.

Product Details
Table of Contents

Product Details

ISBN-13:	9780791801680
Publisher:	A S M E Press
Publication date:	01/29/2002
Series:	ASME Press Book Series on Electronic PAC
Edition description:	New Edition
Pages:	440
Product dimensions:	6.20(w) x 9.30(h) x 1.20(d)

	List of Figures	xi
	List of Tables	xvii
	Nomenclature	xix
	Foreword	xxiii
	Preface	xxv
Chapter 1	Introduction	1
1.1	Need for Thermal Control	1
1.2	Reliability and Temperature	3
1.3	Levels of Thermal Resistance	4
1.4	Thermal Design Considerations	5
1.5	Optimization and Life-Cycle Cost	6
Chapter 2	Conduction	9
2.1	Fundamental Law of Heat Conduction	9
2.2	General Differential Equations for Conduction	10
2.3	One-Dimensional Heat Conduction	16
2.4	Thermal/Electrical Analogy	17
2.5	Lumped-System Transient Analysis	20
2.6	Heat Conduction with Phase Change	25
Chapter 3	Convection	31
3.1	Flow and Temperature Fields	31
3.2	Heat Transfer Coefficient	34
3.3	Parameter Effects on Heat Transfer	35
3.4	Pressure Drop and Friction Factor	43
3.5	Thermal Properties of Fluids	46
3.6	Correlations for Heat Transfer and Friction	47
Chapter 4	Radiation	53
4.1	Stefan-Boltzmann Law	53
4.2	Kirchhoff's Law and Emissivity	54
4.3	Radiation Between Black Isothermal Surfaces	55
4.4	Radiation Between Gray Isothermal Surfaces	58
4.5	Extreme Climatic Conditions	61
Chapter 5	Pool Boiling	67
5.1	Boiling Curve	67
5.2	Nucleate Boiling	70
5.3	Incipient Boiling at Heating Surfaces	72
5.4	Nucleate Boiling Correlations	76
5.5	Critical Heat Flux Correlations	77
5.6	Minimum Heat Flux Correlations (Leidenforst Point)	79
5.7	Parameters Affecting Pool Boiling	81
5.8	Effect of Gravity on Pool Boiling	87
Chapter 6	Flow Boiling	95
6.1	Flow Patterns	95
6.2	Heat Transfer Mechanisms	95
6.3	Boiling Crisis	98
6.4	Heat Transfer Equations	99
6.5	Thermal Enhancement	109
6.6	Pressure Drop	109
Chapter 7	Condensation	115
7.1	Modes of Condensation	115
7.2	Heat Transfer in Filmwise Condensation	116
7.3	Improvements Over Nusselt Analysis	121
7.4	Condensation Inside a Horizontal Tube	123
7.5	Noncondensable Gas in a Condenser	127
Chapter 8	Extended Surfaces	131
8.1	Uniform-Cross Section Fins	131
8.2	Fin Efficiency	134
8.3	Selection and Design of Fins	137
Chapter 9	Thermal Interface Resistance	141
9.1	Factors Affecting Thermal Contact Resistance	141
9.2	Joint Thermal Contact Resistance	145
9.3	Methods of Reducing Thermal Contact Resistance	147
9.4	Solder and Epoxy Joints	159
9.5	Practical Design Data	160
Chapter 10	Components and Printed Circuit Boards	169
10.1	Chip Packaging Technology	169
10.2	Chip Package Thermal Resistance	172
10.3	Chip Package Attachment	173
10.4	Board-Cooling Methods	176
10.5	Board Thermal Analysis	177
10.6	Equivalent Thermal Conductivity	178
Chapter 11	Direct Air Cooling and Fans	185
11.1	Previous Work	185
11.2	Heat Transfer Correlations	187
11.3	Pressure Drop Correlations	190
11.4	Heat Transfer Enhancement	194
11.5	Fans and Air-Handling Systems	197
Chapter 12	Natural and Mixed Convection	213
12.1	Parallel Plates	214
12.2	Straight-Fin Arrays	220
12.3	Pin-Fin Arrays	229
12.4	Enclosures	234
12.5	Mixed Convection in Vertical Plates	237
Chapter 13	Heat Exchangers and Cold Plates	243
13.1	Compact Heat Exchangers	243
13.2	Flow Arrangement of Heat Exchangers	244
13.3	Overall Heat Transfer Coefficient	244
13.4	Heat Exchanger Effectiveness	245
13.5	Heat Exchanger Analysis	246
13.6	Heat Transfer and Pressure Drop	248
13.7	Geometric Factors	250
13.8	Cold-Plate Analysis	251
13.9	Correlations	255
Chapter 14	Advanced Cooling Technologies I: Single-Phase Liquid Cooling	261
14.1	Coolant Selection	261
14.2	Natural Convection	265
14.3	Forced Convection	267
Chapter 15	Advanced Cooling Technologies II: Two-Phase Flow Cooling	283
15.1	Figure of Merit	283
15.2	Direct-Immersion Cooling	285
15.3	Enhancement of Pool Boiling	287
15.4	Flow Boiling	300
Chapter 16	Heat Pipes	309
16.1	Operation Principles	309
16.2	Useful Characteristics	309
16.3	Construction	311
16.4	Operation Limits	312
16.5	Materials Compatibility	318
16.6	Operating Temperatures	320
16.7	Operation Methods	321
16.8	Thermal Resistances	323
16.9	Applications	325
16.10	Micro Heat Pipes	330
Chapter 17	Thermoelectric Coolers	335
17.1	Basic Theories of Thermoelectricity	335
17.2	Net Thermoelectric Effect	337
17.3	Figure of Merit	338
17.4	Operation Principles	339
17.5	System Configurations	339
17.6	Performance Analysis	340
17.7	Practical Design Procedure	344
	Appendices	349
A.	Material Thermal Properties	349
B.	Thermal Conductivity of Silicon and Gallium Arsenide	351
C.	Properties of Air, Water, and Dielectric Fluids	353
D.	Typical Emissivities of Materials	371
E.	Solar Absorptivities and Emissivities of Common Surfaces	373
F.	Properties of Phase-Change Materials	375
G.	Friction Factor Correlations	377
H.	Heat Transfer Correlations	381
I.	Units Conversion Table	403
	Index	405
	About the Authors	413

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