Lead-Free Soldering in Electronics / Edition 1

by Katsuaki Suganuma, K. Suganuma

Overview

Assessing the scientific and technological aspects of lead-free soldering, this reference considers the necessary background and requirements for proper alloy selection-highlighting the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics.

Product Details

ISBN-13:	9780824741020
Publisher:	Taylor & Francis
Publication date:	12/11/2003
Edition description:	New Edition
Pages:	376
Product dimensions:	6.12(w) x 9.25(h) x 1.00(d)

Table of Contents

Introduction to Lead-Free Soldering Technology, K. Suganuma
Materials Science Concepts in Lead-Free Soldering, C. Handwerker, U. Kattner, and K. Moon
Alloy Selections, K. Nimmo
Plating Lead-Free Soldering in Electronics, H. Nawafune
Tin Whisker Discovery and Research, Y. Zhang
Mechanical Evaluation in Electronics, W.J. Plumbridge
Electrochemical Migration, H. Tanaka
Lead-Free Solder Paste and Reflow Soldering, S. Fujiuchi
Wave Soldering, T. Nishimura
Soldering Inspection and Design for Lead-Free Solder: Soldering Innovation by Trinity of Design,Process, and Inspection, M. Hirano
Future of Lead-Free Soldering, K. Suganuma
Index